At the Mobile World Congress 2019, LG Electronics is once again set to remind audiences of its reputation and history as a leader in smartphone sound with the new LG G8 ThinQ that will come with Crystal Sound OLED (CSO), an innovative technology that utilises the phone’s OLED display as an audio amplifier.
As more consumers are now shifting to smaller screens and with the deep penetration of internet in smartphones which now act as their primary devices for watching movies, playing games and consuming music, the demand for mobile phones capable of delivering high-quality audio is higher than ever. LG wants to create this experience with the G8 ThinQ.
Developed in-house by LG, CSO repurposes the OLED display as a diaphragm, vibrating the entire surface to produce sound with great volume. And because LG’s unique technology takes advantage of the entire display, CSO also improves clarity, making voices easier to discern and subtle musical notes more noticeable.
In speakerphone mode, audio is delivered with impressive bass through the bottom speaker. Full-bodied stereo performance is possible with a two-channel audio setup utilising this bottom speaker and the top part of the display. As well as improving the sound, CSO also gives the LG G8 ThinQ a clean, minimalist look.
Other notable features in the G8 ThinQ include DTS X 3D surround sound that emulates a 7.1-channel system with or without earphones (a first for LG), Hi-Fi quad DAC and the added ability to up-sample most audio files for increased clarity and depth
By developing new technologies as well as working closely in partnership with the audio industry’s best partners, LG will continue to deliver the quality of sound that consumers demand and deserve,’ said Chang Ma, Senior Vice President and Head of Product Strategy at LG Electronics.
According an earlier press statement by LG, the G8 ThinQ will come with time-of-flight (TOF) camera. The company has partnered with Infineon Technologies AG to deliver this technology to smartphone selfie photo lovers world over.
‘Infineon’s REAL3TM image sensor chip will play a key role in the front-facing camera of the upcoming LG G8 ThinQ. Building upon the combined expertise of Infineon and pmdtechnologies in algorithms for processed 3D point clouds (a set of data points in space produced by 3D scanning), the innovative sensor will deliver a new level of front camera capability in a smartphone,’ the company said in a press statement.
While other 3D technologies utilise complex algorithms to calculate an object’s distance from the camera lens, the ToF image sensor chip delivers more accurate measurements by capturing infrared light as it is reflected off the subject. As a result, ToF is faster and more effective in ambient light, reducing the workload on the application processor thereby also reducing power consumption.
