MWC 2018: Qualcomm 700 mobile platform to make smartphones AI rich

By Anuj Sharma - February 28, 2018
snapdragaon-700
Chip maker Qualcomm has introduced a new Snapdragon 700 mobile platform Series designed to make mid-price segment smartphones AI-rich at the ongoing Mobile World Congress (MWC) 2018 in Barcelona, Spai....

Chip maker Qualcomm has introduced a new Snapdragon 700 mobile platform Series designed to make mid-price segment smartphones AI-rich at the ongoing Mobile World Congress (MWC) 2018 in Barcelona, Spain.

The platform includes on-device AI supported by the Qualcomm Artificial Intelligence (AI) engine and brings improvements to camera, device performance and power, supported Spectra ISP, Qualcomm Kryo CPU, Hexagon vector processor and Adreno visual processing subsystem.

The 700 series products will also benefit from Qualcomm Quick Charge 4+ technology, which is designed to provide up to 50 per cent charge in only 15 minutes of charging. The Snapdragon 700 will feature an advanced suite of wireless technologies with ultra-fast LTE, carrier Wi-Fi features, as well as enhanced Bluetooth 5, the company said.

The first Snapdragon 700 series devices are expected to ship to customers in the first half of 2018.

‘The Snapdragon 700 Mobile Platform Series will bring premium tier technologies and features into more affordable devices, something our global OEM customers and consumers are demanding. From our cutting-edge Qualcomm AI Engine to superior camera, device performance and power, the Snapdragon 700 Series is optimised to support the experiences consumers have come to expect from the most advanced mobile devices at a lower price point,’ said Alex Katouzian, Senior Vice President and General Manager, Mobile, Qualcomm Technologies.

The company also announced Snapdragon 5G module solutions to support original equipment manufacturers (OEMs) looking to capitalise on 5G technologies in smartphones and other major verticals.

Key components in the 5G module include application processor, baseband modem, memory, power management integrated circuit (PMIC), RF Front-End (RFFE), antennas and passive components.

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