Chip maker Qualcomm and display manufacturer BOE has collaborated to develop innovative display products, which would use Qualcomm 3D Sonic sensors. This collaboration is expected to extend from mobile and associated 5G technologies to XR and IoT.
Under the agreement, both the companies have started working on incorporating value-added and distinctive features to BOE’s flexible OLED panels, including the Qualcomm 3D Sonic sensor. The integration of 3D Sonic sensors onto BOE’s flexible OLED displays would result in a more streamlined solution, which will allow smartphone OEMs to create unique products using the thinnest and highest security fingerprint solution. This collaboration would also make for a streamlined supply chain with a reduction in bill of materials (BoM) and research and development expenses.
BOE will offer integrated displays with Qualcomm 3D Sonic fingerprint sensors to its customers. Commercial devices coming with this integrated solution would be available in the second half of 2020.
‘BOE will start shipping flexible OLED panels with integrated Qualcomm 3D Sonic sensors during the second half of 2020,’ said Wenbao Gao, Executive Vice President and Chief Executive Officer of display and sensor, BOE.
Qualcom’s Senior Vice President and Chief Operations Officer Roawen Chen said that ‘through this collaboration, we expect that OEMs will have more opportunities to design cutting-edge products that feature OLED displays made with the Qualcomm 3D Sonic fingerprint sensor technology. We look forward to further strengthening our innovative collaborations with BOE in key areas like 5G, XR and IoT.
