MediaTek is set to launch the Dimensity 9300+ chipset at its Developer Conference in China on May 7. The upcoming processor will succeed the Dimensity 9300 SoC and pack more features such as an updated Cortex-X4 core with a maximum clock rate of 3.4GHz (up from 3.25GHz). There's no official mention, but the new processor is expected to include AI capabilities. At last year's Conference on May 10, MediaTek debuted the Dimensity 9200+, adopted by brands like Vivo, Oppo, and Xiaomi. According to reports, the Taiwanese company is developing the Dimensity 9400, a new-gen flagship chipset that will likely be released in the fourth quarter of this year. Leaks indicate that the processor will use a 3nm TSMC node (N3E) and replace the primary core with a Cortex-X5 (with other cores remaining unchanged, i.e., 4x A720 and 3x X4). Coming to the Dimensity 9300+, let's take what's in store for us.
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The Dimensity 9300+, based on TSMC's superior 4nm technology, is expected to employ a prime Cortex-X4 core with speeds up to 3.4GHz, alongside three Cortex-X4 cores and four A720 cores with speeds up to 2.0GHz and 2.85GHz, respectively. Industry reports state that this combination will significantly increase GPU capabilities by up to 46%, and enhance the overall performance, promising superior gaming experiences and lasting battery.
The Taiwanese manufacturer's theme for its upcoming conference is '#AIeverything', suggesting its integration of AI capabilities in its new Dimension 9300+ model. The mid-range processor is expected to feature a faster APU (AI Processing Unit). The Vivo X100s and x100s Pro, set to arrive in China next month, are expected to be the first smartphones to sport the Dimensity 9300+ technology, though no official confirmation has been made. The Vivo X100S smartphone is likely to come with a glass back, a flat metal frame, a 6.78-inch 1.5K 8T LTPO OLED straight screen, and 120W fast charging.
